Methods and Apparatus for Glass Removal in CMOS Image Sensors

ABSTRACT

Methods for glass removal while forming CMOS image sensors. A method for forming a device is provided that includes forming a plurality of pixel arrays on a device wafer; bonding a carrier wafer to a first side of the device wafer; bonding a substrate over a second side of the device wafer; thinning the carrier wafer; forming electrical connections to the first side of the device wafer; subsequently de-bonding the substrate from the second side of the device wafer; and subsequently singulating individuals ones of the plurality of pixel arrays from the device wafer. An apparatus is disclosed.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is related to, and claims priority to U.S. ProvisionalApplication No. 61/625,969; entitled “Glass-removal TSV Method for CMOSImage Sensors and Resulting Structures”, filed Apr. 18, 2012, which isherein incorporated in its entirety by reference.

BACKGROUND

The industry drive toward smaller size packages for integrated circuitsis driving the adoption of 3D stacking of dies with TSV (Through SiliconVia, sometimes Through Substrate Via) connections as well as wafer levelpackaging of devices. These technologies will become increasinglyadvantageous in the field of CMOS image sensors.

In a conventional fabrication process, an active device wafer including,for example, CMOS image sensors devices, is provided. Color filter array(CFA) and microlens (ML) materials may be formed over the CMOS imagesensors. The CFA and ML material is disposed in locations correspondingto photodiodes in the CMOS image sensors so that impinging light may bedirected onto the photodiodes.

A glass substrate may be bonded over the active device wafer and overthe photodiodes. On an opposing surface of the structure, a through viaprocess such as TSV may be performed to open vias to metallizationlayers. An isolation oxide may be formed in the through vias. Aconductor material may be deposited in the through vias and may extendto the metallization layers to form an electrical connection to the CMOSimage sensor devices. A redistribution layer (RDL) may be formed overthe through vias and patterned to form traces. External connectors maybe formed on the traces to complete a package for the CMOS image sensordevices. A sawing or dicing operation may then separate the activedevice wafer, the glass substrate, into individual integrated circuitmodules each forming CMOS image sensor devices for use in a system.

Traditional CIS devices involve limitations, such as (1) the top glasslayer, used in manufacturing the device, reduces the opticalperformance; and (2) the CTE (Coefficient of Thermal Expansion) mismatchbetween, e.g., the active device wafer upon which the device is formed,and, e.g., a glass substrate used for manufacturing, induces waferwarping and bowing, resulting in performance non-uniformity andreliability concerns.

BRIEF DESCRIPTION OF THE DRAWINGS

For a more complete understanding of the illustrative embodiments, andthe advantages thereof, reference is now made to the followingdescriptions taken in conjunction with the accompanying drawing, inwhich:

FIG. 1 depicts, in a cross sectional view, an active device wafer whichis a FSI CIS example device for use with the embodiments;

FIG. 2 depicts, in a cross sectional view, the active device wafer ofFIG. 1, following additional processing;

FIG. 3 depicts, in a cross sectional view, the active device wafer ofFIG. 2, following additional processing;

FIG. 4 depicts, in a cross sectional view, the active device wafer ofFIG. 3, following additional processing;

FIG. 5 depicts, in a cross sectional view, the view the active devicewafer of FIG. 4, following a de-bonding process;

FIG. 6 depicts, in a cross sectional view, the active device wafer ofFIG. 5, in a singulation process;

FIG. 7 depicts, in a cross sectional view, an active device wafer whichis a BSI CIS example device for use with the embodiments;

FIG. 8 depicts, in a cross sectional view, the active device wafer ofFIG. 7, following additional processing;

FIG. 9 depicts, in a cross sectional view, the active device wafer ofFIG. 8, following additional processing;

FIG. 10 depicts, in a cross sectional view, the active device wafer ofFIG. 9, following additional processing;

FIG. 11 depicts, in a cross sectional view, the view the active devicewafer of FIG. 10, in a de-bonding process; and

FIG. 12 depicts, in a cross sectional view, the active device wafer ofFIG. 11, in a singulation process.

Corresponding numerals and symbols in the different figures generallyrefer to corresponding parts unless otherwise indicated. The figures aredrawn to clearly illustrate the relevant aspects of the preferredembodiments and are not necessarily drawn to scale.

DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS

The making and using of example illustrative embodiments are discussedin detail below. It should be appreciated, however, that the embodimentsprovide many applicable inventive concepts that can be embodied in awide variety of specific contexts. The specific example embodimentsdiscussed are merely illustrative of specific ways to make and use theembodiments, and do not limit the scope of the application, theembodiments, or the appended claims.

Illustrative embodiments include glass-removal steps on active devicewafers with through-vias, including, e.g., CMOS image sensors (CIS),which provide for improved performance and reliability. Advantageousfeatures of the disclosed embodiments may include, but are not limitedto increasing the transmittance of a light source for improved opticalperformance—e.g., improved quantum efficiency (QE) for the imagesensors; and avoiding coefficient of thermal expansion (CTE) mismatchbetween a Si wafer upon which the device is formed and a glass substrateas used in prior approaches.

Generally speaking the embodiments illustrated in the accompanyingfigures provide for a glass substrate attached to a CIS wafer by atemporary bonding material. After appropriate process steps, the glasssubstrate may be de-bonded from the CIS wafer simply by heating, or bythe use of UV to release a UV sensitive adhesive, or by the use ofchemical release agents. In the thermal release case, heat applied overa critical temperature changes the properties of a temporary adhesiveand releases the glass substrate. The de-bonding occurs before dicingthe CIS wafer into individual devices (e.g., dies). The CIS wafer maythen be cleaned to remove any adhesive residue and processing continueswith dicing to singulate the devices, and the individual CIS devices maythen be used in a system, for example.

Although the examples presented herein to illustrate the embodimentsdescribe active device wafers that include CMOS image sensors, themethods may be applicable to other types of wafers that are processedusing carrier substrates. For example, wafer thinning operations can beperformed for the fabrication of through-vias on any number of differenttypes of devices, including processors such as digital signalprocessors, analog processors, microprocessors, RISC or ARM processors,that may be combined in 3D structures with other devices such asvolatile and non-volatile memory devices. Processing on the back side ofthe active device wafer may require that the wafer be temporarily bondedto a glass substrate. Use of the embodiments is applicable to manydifferent wafer processing contexts and is not limited to the specificexamples described herein, which are active device wafers includingfront side illuminated (FSI) and back side illuminated (BSI) CMOS imagesensors.

Turning now to the illustrated embodiments, FIG. 1 illustrates in across sectional view an active device wafer 11 including front sideilluminated (FSI) image sensor devices 11A and 11B at an intermediatestage of manufacture. As shown, a pixel array of photodiodes 23 has beenformed on a semiconductor wafer 13 for each of two devices 11A and 11B.Various electrical components have been formed in back end of line(BEOL) layers 15 over the wafer 13, as is generally known in the art.For example, polysilicon gate material 17 may be formed over thephotodiodes 23 and other devices, such as transistors, capacitors,diodes and the like may be formed in the wafer 13 or in the BEOL layer15. The semiconductor wafer 13 includes portions of two CIS devices 11Aand 11B, which are formed on either side of a central portion of wafer13. As shown, the photodiodes 23 form two pixel arrays on either side ofthe external pad metallization layers 31, and the symmetric structuresform symmetric sensor devices 11A and 11B on the wafer 13, although onlya small portion of wafer 13 is illustrated. In a practical active devicewafer 11, each sensor 11A and 11B would have many millions ofphotodiodes 23 and the semiconductor wafer 13 would have many sensordevices such as 11A and 11B formed thereon. That is, in a practicalactive device wafer many sensor devices would be formed, each havingmillions of photodiodes in arrays and including access transistors,reset transistors, and transfer transistors for reading the storedcharge after receiving light.

The BEOL layers 15 also include several metallization layers from afirst metal layer, or metal-1, usually the metal layer nearest thesurface of the wafer 13, to a top level metal or top metal, near theupper surface of the BEOL layers 15. The metallization layers 31 formthe external connections to the photodiodes and may include coppermetallization or aluminum metallization or combinations of these. Singleor dual damascene processes may be used to form the metallizationlayers. The wafer 13 has the BEOL layers 15 on a front side surface 33,and wafer 13 has an opposing back side surface 35. Through-vias 29 areshown formed into the wafer 13. These through-vias are formed duringfront end of the line (FEOL) processes and may be formed by a siliconetch, or laser drilling operation, which forms deep trenches into thewafer 13. The through-vias 29 may be formed in a via first process, forexample. The through-vias 29 may be lined with a barrier material 25which may be an oxide, silicon nitride, or similar barrier material andwhich may include tantalum or titanium and nitride, for example. Thethrough-vias 29 are filled with a conductor. Aluminum or copper or thelike may be used, electroplating or other metal deposition such as PVDmay be used to form the conductors. Alternatively, conductive plugs suchas tungsten plugs may be used to fill the through-vias 29.

FIG. 2 depicts in another cross sectional view the active device waferfollowing additional processing. In FIG. 2, color filter array (CFA)material 27 is formed over the exposed surface of the BEOL layer 25. TheCFA material passes certain light spectrum to a corresponding photodiode23 and with the photodiodes forms an array of color pixels. Red, greenand blue (RGB) color filters may be used, for example. Microlens (ML)material 21 is then formed over the color filter array material 27 andincreases performance in the system by focusing incipient light onto thephotodiodes 23 through the color filter array material. The CFA and MLmaterials may be formed using a coating or other deposition step and asubsequent photolithographic process to pattern the coating using aphotoresist that is patterned over the coating layer, to form an etchmask for example, and a patterning step, followed by a photoresist stripfor example.

As described above the cross sectional view of active device wafer 11depicts a portion of two CIS sensor devices 11A and 11B that are formedsimultaneously using wafer level processing, and so there are shown twosymmetrically positioned portions of CFA material and ML material, oneportion for each of the two devices. In a practical active device wafer,hundreds or more of the CIS sensor devices will be arranged on a singlewafer 13.

A temporary bonding material 37 is formed over the CFA 27 and ML 21material. This temporary bonding material may be, as an exampleembodiment, a heat release adhesive used for semiconductor processes.For one non-limiting and illustrative example, WaferBOND™ HT is a heatrelease temporary adhesive available from Brewer Science, Inc. in Rolla,Mo., USA. This material provides a heat releasable temporary bondingadhesive for bonding wafers or substrates. The bond is later released byapplication of heat over a critical temperature. Alternative materialsfor the temporary bonding material include UV releasable adhesives andchemical release adhesives, which form alternative embodiments. Thesematerials may be applied as a liquid that is spun on to the wafer, or,applied as a film, or provided as tape material. Additional alternativesinclude pressure release bonding materials, for example. The materialsare designed so that when the release step is performed, the bondingmaterial transitions from an adhesive property to a non-adhesiveproperty, enabling release.

A glass or other like substrate 41 is then adhered to the front sidesurface of the active device wafer 11 by use of the temporary bondingmaterial 37. The glass substrate 41 provides mechanical support to thewafer 13 during the various processes that follow. These are describedbelow and may include, among other processes, wafer thinning of thewafer 13. The resulting very thin wafer 13 will be flexible and withoutthe additional mechanical support, might not be able to withstand thevarious additional process steps described below.

FIG. 3 depicts, in another cross sectional view, the active device wafer11 following additional processing steps. To transition from the processstage of FIG. 2 to the stage shown in FIG. 3, the back side surface 35of wafer 13 is thinned. The wafer thinning proceeds at least to a pointwhere the wafer 13 is thin enough so that the bottom portion of thethrough-vias 29 is exposed. This wafer thinning may be done by using oneor more of mechanical grinding, chemical substrate etches, and chemicalmechanical polishing (CMP) to remove the wafer material. After the waferthinning process, the wafer 13 may be as thin as 200 microns or less,and may be in a thickness range from 80 to 250 microns. In an exampleembodiment, a thickness of 100 microns was used.

The through-vias 29 now extend from the back side 35 of the wafer 13 andprovide an electrically conductive path through the wafer 13 to themetallization layers 31 of the BEOL layer 15. As described furtherbelow, the through-vias 29 can now form the electrical connections fromthe back side of the active device wafer 11 to the photodiodes 23, or toother circuitry, for example.

FIG. 4 depicts in another cross sectional view the active device wafer11 following additional processing steps. To transition from the stageshown in FIG. 3 to the stage of FIG. 4, several steps were performed. Anisolation layer 37 was formed over the back side surface 35 of the wafer13. This may be a thermal oxide, or it may be formed by CVD, PECVD andthe like. Other dielectrics such as silicon nitrides or siliconoxynitrides may be used. A conductive redistribution layer (RDL) 43 isformed over the isolation layer 37 and extends in openings in theisolation layer 37 to the through-vias 29; the conductive RDL materialforms an electrical connection to the through-vias 29. The RDL layer 43may be copper, aluminum or alloys of these and may be electroplated, orotherwise deposited. For example, a PVD deposition process may be usedto deposit the RDL. A passivation layer 47 is formed over the RDL layer43. Openings are formed in the passivation layer, which may be a siliconnitride, a polymer layer, polyimide or other passivation material.External connectors such as ball grid array (BGA) terminals 45 areformed in the openings and extend to the RDL layer 43 and through thepassivation layer 47 in the openings. The external connectors 45 willform the electrical connections to the system for the finished CISsensor devices. External connectors 45 are shown in FIG. 4 as BGA solderballs and may be formed by use of a solder plating process, followed bya thermal reflow to shape the solder balls. Solder bumps may be used.Conductive pillars such as copper pillars may be used. Stud bumps orwire bond ball bumps may be used. Columns, pillars, balls and bumps areall possible shapes for the external connectors 45. Copper and alloysincluding nickel and gold may be used. The solder balls 45 could beformed of lead based solder or lead free solder including silver, tin,copper eutectics. External finishes such as electroless nickel,immersion gold (ENIG), and electroless nickel electroless palladiumimmersion gold (ENEPIG), gold, nickel and alloys of these may be used,for example.

FIG. 5 depicts in cross section the active device wafer 11 in ade-bonding process. The temporary bonding material 37 (not shown in FIG.5, see FIG. 4 for example) has been removed. These materials are formedwith a release mechanism that changes the material from an adheringmaterial to a non-adhesive material. The Waferbond™ HT material is aheat release material. Other temporary bonding materials may be UVreleased, that is, the material is sensitive to certain light energysuch as ultra-violet light, and will transition to a release state whenexposed to UV. Some materials may release with mechanical pressure orwith exposure to chemical release agents that cause a transition in thematerial.

After the de-bonding step, for example by applying sufficient heat, isperformed, the glass substrate 41 is removed from the front side ofactive device wafer 11. By removing the glass substrate 41 at thisstage, several advantages result due to use of the embodiments. Unlikein the prior approaches, where the glass substrate remains over the CISsensors in the finished devices, with the embodiment structure such asin FIG. 5, incipient light into the CIS sensors is not impeded by theglass substrate and the bonding material, which are both removed withuse of the embodiments. The amount of incipient light is thereforeincreased at the photodiodes, thus increasing the quantum efficiency(QE) of the sensors.

Further, the removal of the glass substrate at this stage also removes asource of CTE mismatch in subsequent processes, and a potential CTEmismatch when the finished sensors are used in a system application.Because glass 41 and the silicon or semiconductor wafer 13 havesubstantially different thermal properties, if the glass is kept as partof the finished sensors, warping and bowing of the silicon wafer 13 mayoccur either in the various processes that follow, such as dicing, orduring use of the sensor in a system.

FIG. 6 illustrates is a cross sectional view the active device wafer 11in a dicing operation that separates the CIS sensors 11A and 11B fromone another by dicing the wafer 13 into individual integrated circuitdevices, or dies. The dicing operation may be performed by a mechanicalwafer sawing, by laser dicing, or by combinations of these, by scribing,trenching and etching operations, and combinations of these or likeoperations. In the embodiment methods, when the glass substrate 41 isremoved prior to the dicing operation (see FIG. 5 above) the dicingoperation is less stressful as only wafer 13 has to be cut through, incontrast to prior approaches which required sawing both silicon wafersand the glass substrates at the same time, thus use of the embodimentsfurther reduce vibration and mechanical stress on the active devicewafer.

After the CIS sensors 11A and 11B are separated as indicated by thearrows in FIG. 6, these individual integrated circuit devices (dies) maythen be mounted to a system board or another substrate using the BGAterminals 45 as connectors. The sensor microlens 21 and color filterarray 27 materials are not surrounded by any bonding material, and thereis no glass substrate between the sensor devices and the system lens,thus the incipient light on the photodiodes is increased when comparedto prior FSI CIS structures. The microlens material is exposed to air orperhaps a vacuum in the ambient environment and light from a system lensis not required to traverse any other materials prior to impinging onthe microlens material 21.

FIG. 7 depicts in a cross sectional view an intermediate stage ofanother illustrative embodiment. In FIG. 7 an active device wafer 51 isdepicted and will form back side illuminated (BSI) sensors. Severalelements of this alternative embodiment are the same as for the FSIembodiments shown in FIGS. 1-6, and like numerals are used for likeelements. In FIG. 7, a semiconductor wafer 13 such as a silicon wafer isshown with photodiodes 23 formed therein. As shown for explanation inFIG. 7, the wafer 13 is rotated 180 degrees from the illustrative viewsabove in FIGS. 1-6 so that the BEOL layer 15 including external padmetallization layers 31 are shown beneath the wafer 13, that is, thefront side surface is below the wafer 13. A carrier wafer 55 is waferbonded to the BEOL layer 15. The carrier wafer 55 may be a siliconwafer, or another semiconductor wafer such as gallium arsenide, indium,germanium, or the like.

As described above, the active device wafer 51 includes many CIS sensordevices. The portion of the wafer 51 shown in FIG. 7 depicts only aportion of two devices 51A and 51B that are arranged symmetricallyaround a center line. Each BSI image sensor device 51A and 51B has atarray of photodiodes 23 in wafer 13, and metallization layers 31 in BEOLlayer 15, bonded to carrier wafer 55. In a practical device wafer manysensor devices would be formed, each having thousands of photodiodes inarrays and including access transistors, reset transistors, and transfertransistors for reading the stored charge after receiving light.

FIG. 8 depicts in a cross sectional view the active wafer device 51following additional processing steps. In transitioning from theintermediate process stage shown in FIG. 7 to the stage of FIG. 8, colorfilter array material 27 is formed over the back side surface 35 of thewafer 13. Microlens material 21 is formed over the color filter arraymaterial 27. In contrast to the FSI embodiments of FIGS. 1-6, the lightimpinging on the photodiodes 23 in the embodiments using BSI will nottraverse through BEOL layer 15, and thus, the amount of light impingingon the photodiodes 23 will be increased for the BSI CIS devices,increasing the efficiency. For this reason, the use of BSI image sensorsis increasing, although as shown above the embodiments are not limitedto BSI embodiments.

In FIG. 8, a temporary bonding material 37 is applied over the CFA 27and the ML 21 materials. This material forms an adhesive and a glasssubstrate 41 is positioned over the wafer 13 and temporarily bondedusing the bonding material 37. As described above this bonding material37 may be a heat releasable material, or a UV or chemical releasablebonding material may be used as alternative embodiments.

FIG. 9 depicts, in another cross sectional view, the active device wafer51 following additional processing steps. In FIG. 9, the carrier wafer55 has been thinned using a wafer thinning process, which may includeCMP, mechanical grinding, silicon etch, or combinations of these toreduce the carrier wafer thickness to a range of 80 to 250 microns, forexample, in an embodiment, 100 microns was used.

After the wafer thinning process on the carrier wafer 55 is performed,photolithography and etch processes are used to etch vias 57 through thecarrier wafer 55. These vias will form through-vias to the external padportion of the metallization layers 31 for each device 51A and 51Bshown. The carrier wafer etch may be performed using dry etch such as anRIE etch for example, plasma etch or other silicon etch processes couldbe used.

FIG. 10 depicts in a cross sectional view the active device wafer 51 ofFIG. 9 following additional processing steps. In transitioning from theintermediate stage shown in FIG. 9 to FIG. 10, the external connectionsand passivation processes are performed. An isolation layer 59 is formedover the exposed surface of the carrier wafer 55. This isolation layermay be a thermal oxide, or may be a nitride or oxynitride or the like.The isolation layer 59 may be thermally grown or deposited using CVD,PECVD or like oxide deposition processes. The isolation layer 59 isopened in the through-vias 57 by an oxide etch. An RDL layer 63 is thendeposited. The conductive RDL layer 63 is formed into the through-vias57 and contacts the pad portion of the metallization layers 31. In thismanner, electrical connection may be made to the photodiodes 23 in theactive wafer devices, for example, from the exposed surface of carrierwafer 55. A passivation layer 67, which may be silicon nitride, or apolyimide, or the like, is formed over the RDL layer 63. The passivationlayers is then opened by photolithography and etch over selectedportions of the RDL layer 63, which form traces on the bottom of thecarrier wafer 55. External connectors 65, which may be solder balls fora ball grid array (BGA) package, for example, are formed into theseopenings to make external connections to the RDL layer 63. The externalconnectors 65 may be solder balls, solder bumps, conductive pillars suchas copper pillars, conductive columns, stud bumps, wire bond bumps, orthe like, as described above. Finish platings may be formed over theexternal connections 65, as described above.

FIG. 11 depicts the glass substrate 41 being de-bonded from the activedevice wafer 51. The temporary bonding material (not visible) isprocessed to release the substrate 41. In an illustrative embodiment aheat release bonding material is used. Alternatives include chemicalrelease and UV release bonding materials. Release can be accomplished byapplying ultra-violet (UV) light to a UV sensitive bonding material.Alternatively, an appropriate solvent could be employed to dissolve thebonding material. Other alternatives will be clear to those skilled inthe art, including the application of a material that interacts with thebonding material to counter-act or otherwise neutralize the bondingmaterials adhesive/cohesive properties.

The glass or other substrate 41 has provided support during the waferthinning and through-via processes described above, but it is nowremoved prior to the wafer 13 being diced into individual integratedcircuits (dies). Unlike BSI sensors formed using prior known approaches,the finished devices 51A and 51B will not have the glass substrate 41 orthe temporary bonding material (not shown) over them and in the lightpath between a system lens and the photodiodes, so that use of theembodiments increases the available light at the photodiodes and thusimproves the quantum efficiency (QE) for the BSI image sensors.

FIG. 12 depicts, in a cross sectional view, the active device wafer 51in a dicing operation. Devices 51A and 51B will be separated by wafersawing or dicing the wafer 13 in the portion between the devices. Thedevices 51A and 51B (and many more, only two devices are shown forsimplicity, the wafer 13 will have many BSI devices formed thereon) willeach be a BSI CIS integrated circuit that can then be mounted in asystem using the external connectors 65.

Use of the embodiments provides CIS sensors without the glass substrateand bonding materials of the prior approach CSI sensors in the pathbetween a system lens and the microlens material of the CIS sensor. BothFSI and BSI CIS sensors may benefit from the use of the embodiments. Asensor formed with the embodiments has the microlens material over thephotodiodes exposed to air or the ambient environment, without beingcovered by glass or a bonding material, increasing the amount of lightat the photodiodes.

In a method embodiment, the method includes forming a plurality of pixelarrays on a device wafer; bonding a substrate to the device wafer;thinning the device wafer; forming electrical connections on the devicewafer after bonding the substrate to the device wafer; de-bonding thesubstrate from the device wafer; and singulating individuals ones of theplurality of pixel arrays from the device wafer. In a furtherembodiment, the above method includes wherein singulating includessawing, lasering, scribing, pressing, etching, and combinations thereof.In still another embodiment, in the above methods the substratecomprises glass. In yet another embodiment, the device wafer includes afront side illumination (FSI) CMOS image sensor (CIS). In a furtherembodiment, in the above methods the substrate is bonded to the devicewafer by a heat release bonding material. In another alternativeembodiment, in the above methods, forming electrical connections on thedevice wafer further comprises thinning the device wafer to exposeconductive through vias in the device wafer. In still anotherembodiment, in the above methods, forming electrical connections on thedevice wafer includes forming a conductive redistribution layer on thedevice wafer. In still another embodiment, in the above methods, formingelectrical connections on the device wafer includes forming solder ballscoupled to the conductive redistribution layer on the device wafer.

In yet another alternative embodiment, a method for forming a deviceincludes forming a plurality of pixel arrays on a device wafer; bondinga carrier wafer to a first side of the device wafer; bonding a substrateover a second side of the device wafer; thinning the carrier wafer;forming electrical connections to the first side of the device wafer;subsequently de-bonding the substrate from the second side of the devicewafer; and subsequently singulating individuals ones of the plurality ofpixel arrays from the device wafer. In still a further embodiment,de-bonding the substrate comprises applying heat to a bonding material.In yet another embodiment, de-bonding the substrate comprises applyingUV light to a bonding material. In still another embodiment, de-bondingthe substrate comprises applying a chemical release agent to a bondingmaterial. In still a further embodiment, in the above methods, formingelectrical connections to the device wafer further comprises etchingthrough-vias through the carrier wafer extending to metallization layersover the device wafer. In another alternative embodiment, formingelectrical connections further comprises depositing conductiveredistribution layer material into the through-vias. In yet anotherembodiment, forming electrical connections further comprises formingexternal connectors coupled to the conductive redistribution layermaterial. In still another embodiment, forming electrical connectionsfurther comprises forming external connectors that are ones selectedfrom the group consisting essentially of solder balls, solder bumps,conductive pillars, conductive columns, lead based solder, lead freesolder, stud bumps, and wire bonds. In yet another embodiment, in theabove methods, the plurality of pixel arrays comprise back sideilluminated (BSI) devices.

An apparatus embodiment includes a device wafer comprising photodiodesarranged in pixel arrays; color filter array material formed over thephotodiodes and over a first surface of the device wafer; microlensmaterial formed over the color filter array material; and externalconnectors formed over a second surface of the device wafer; wherein themicrolens material is exposed. In still a further embodiment, in theabove apparatus the device wafer further comprises a back sideilluminated image sensor. In yet another alternative embodiment, in theabove apparatus the device wafer further comprises a front sideilluminated image sensor.

While the illustrative embodiments have been described herein withreference to specific example embodiments, this description is notintended to be construed in a limiting sense. Various modifications andcombinations of the illustrative embodiments, as well as otheralternative embodiments, will be apparent to persons skilled in the artupon reference to the description. It is therefore intended that theappended claims encompass any such modifications or embodiments.

What is claimed is:
 1. A method for forming a device, comprising:forming a plurality of pixel arrays on a device wafer; bonding asubstrate to the device wafer; thinning the device wafer; formingelectrical connections on the device wafer after bonding the substrateto the device wafer; de-bonding the substrate from the device wafer; andsingulating individuals ones of the plurality of pixel arrays from thedevice wafer.
 2. The method of claim 1, wherein singulating includessawing, lasering, scribing, pressing, etching, and combinations thereof.3. The method of claim 1, wherein the substrate comprises glass.
 4. Themethod of claim 1, wherein the device wafer includes a front sideillumination (FSI) CMOS image sensor (CIS).
 5. The method of claim 1,wherein the substrate is bonded to the device wafer by a heat releasebonding material.
 6. The method of claim 1, wherein forming electricalconnections on the device wafer further comprises thinning the devicewafer to expose conductive through vias in the device wafer.
 7. Themethod of claim 1, wherein forming electrical connections on the devicewafer includes forming a conductive redistribution layer on the devicewafer.
 8. The method of claim 7, wherein forming electrical connectionson the device wafer includes forming solder balls coupled to theconductive redistribution layer on the device wafer.
 9. A method forforming a device comprising: forming a plurality of pixel arrays on adevice wafer; bonding a carrier wafer to a first side of the devicewafer; bonding a substrate over a second side of the device wafer;thinning the carrier wafer; forming electrical connections to the firstside of the device wafer; subsequently de-bonding the substrate from thesecond side of the device wafer; and subsequently singulatingindividuals ones of the plurality of pixel arrays from the device wafer.10. The method of claim 9, wherein de-bonding the substrate comprisesapplying heat to a bonding material.
 11. The method of claim 9, whereinde-bonding the substrate comprises applying UV light to a bondingmaterial.
 12. The method of claim 9, wherein de-bonding the substratecomprises applying a chemical release agent to a bonding material. 13.The method of claim 9, wherein forming electrical connections to thedevice wafer further comprises etching through-vias through the carrierwafer extending to metallization layers over the device wafer.
 14. Themethod of claim 13, wherein forming electrical connections furthercomprises depositing conductive redistribution layer material into thethrough-vias.
 15. The method of claim 14, wherein forming electricalconnections further comprises forming external connectors coupled to theconductive redistribution layer material.
 16. The method of claim 14,wherein forming electrical connections further comprises formingexternal connectors that are ones selected from the group consistingessentially of solder balls, solder bumps, conductive pillars,conductive columns, lead based solder, lead free solder, stud bumps, andwire bonds.
 17. The method of claim 9, wherein the plurality of pixelarrays comprise back side illuminated (BSI) devices.
 18. An apparatus,comprising: a device wafer comprising photodiodes arranged in pixelarrays; color filter array material formed over the photodiodes and overa first surface of the device wafer; microlens material formed over thecolor filter array material; and external connectors formed over asecond surface of the device wafer; wherein the microlens material isexposed.
 19. The apparatus of claim 18, wherein the device wafer furthercomprises a back side illuminated image sensor.
 20. The apparatus ofclaim 18, wherein the device wafer further comprises a front sideilluminated image sensor.